The common methods for drilling holes on ceramic substrates include the following types:
1. Mechanical punching (punching of the raw material)
Advantages: Extremely high efficiency, low cost, suitable for large-scale production of standard holes;

After sintering, ceramic substrates usually need to undergo grinding and polishing. The main purposes are:
1. To correct the warping, flatness and thickness tolerance during sintering, ensuring uniform thickness of the entire board;

Uneven thickness of the extruded dough is a common problem. The main reasons include:

Dehydration and decarbonization (also known as decarbonization) is a process where organic substances in the clay body gradually decompose, vaporize, and are expelled through a series of temperature increases. If this process is not properly controlled, serious adverse effects will occur:

The main purpose of substrate chamfering is to remove the sharp corners at the edges of the substrate, in order to prevent damage or cuts during subsequent handling, assembly and usage.

Sintering is the core process that determines the final performance of the substrate. The key control parameters include:

The tape casting method is an important molding technique for preparing large-area, thin and flat ceramic materials. Since its emergence, tape casting has been used to produce single-layer or multi-layer thin plate ceramic materials. Currently, tape casting has become a key technology for manufacturing multilayer capacitors and multilayer ceramic substrates.

The mainstream production processes of alumina ceramic substrates include:

The binder is the key component that gives strength to the ceramic green body. The selection principles include the following points:

Impurities in the powder can cause serious damage to the substrate.

The particle size of alumina powder is a key factor affecting the quality of the substrate.

The core raw material of the alumina ceramic substrate is alumina (Al₂O₃) powder. High-purity α-alumina powder (96 porcelain, 99 porcelain, 99.6 porcelain, 99.9 porcelain)

The alumina substrate is non-conductive and is an excellent insulating material. Its insulating principle stems from the nature of the material itself.

Alumina ceramic substrates possess excellent high-temperature stability and thermal shock resistance, and their operating temperature range is very wide.

The conventional appearance structural parameters of ceramic substrates are mainly used to evaluate their dimensional accuracy, flatness and surface quality, which is the basis for ensuring their compatibility with subsequent packaging and assembly processes. They mainly include:

Alumina (Al₂O₃) ceramic substrates differ significantly from aluminum nitride (AlN) and silicon nitride (Si₃N₄) substrates in terms of performance, cost and application scenarios.

The mainstream purity of common alumina ceramic substrates is 95%, 96%, 99%, 99.5%, and 99.6%. The main difference lies in that the higher the purity, the better the thermal conductivity, insulation, strength and chemical stability; however, the cost is higher and the processing is more difficult.

Alumina ceramic substrate is an electronic substrate made of ceramic material with alumina (Al₂O₃) as the main component. It has the advantages of high insulation, good thermal conductivity, high mechanical strength, high temperature resistance, good chemical stability, and a thermal expansion coefficient close to that of silicon chips. It is widely used in electronic packaging and power devices as a support, heat dissipation, and interconnection carrier.

The reporter from the Ministry of Environmental Protection has learned that the Ministry of Environmental Protection will issue the "Implementation Plan for Promoting Water Pollution Control in Industrial Agglomerations", requiring the implementation of the "Water Ten Measures" through tough measures. For provincial-level and above industrial agglomerations that fail to complete the tasks on time, all projects for increasing water pollutant emissions will be suspended for approval and verification, and the qualification of the park will be revoked in accordance with regulations.